FPGA and RF engineering services or a new hire: How to decide
Engineering is the hardest role in aerospace and defense to fill. Three questions show whether your FPGA or RF gap needs a new hire or FPGA engineering services.
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The short answer: Payload processing is moving from ground to orbit because satellite sensors now produce more data than downlink windows can carry. Processing on board decides what to keep before it uses link capacity. The trade-off is power, heat and radiation tolerance, all of which are fixed in the board design years before launch.
Earth observation satellite launches are close to tripling decade over decade. Novaspace counts 1,864 launched in the decade to 2023 and forecasts 5,401 for 2024 to 2033. Its current edition puts the figure above 6,500 by 2035. Downlink capacity per spacecraft has stayed roughly where it was. That gap is why compute is moving onto the satellite. The split between what a payload processes in orbit and what it ships to the ground becomes a decision about a circuit board, made years before launch.
The link is the binding constraint. A sensor that produces more data than its contact windows can carry is producing data that will be deleted, and deciding what to delete is a processing job. Do it on the ground and you have already paid the downlink cost. Do it in orbit and you pay in watts, in mass, and in a device that has to survive the radiation environment for the mission’s life.
Key takeaways
- Earth observation satellite launches are forecast to rise from 1,864 (2014–2023) to 5,401 (2024–2033), while downlink capacity per spacecraft has stayed roughly flat.
- Processing data in orbit pays off when it removes data before downlink. ESA’s Φ-sat-1 showed this in 2020 by screening out cloudy imagery on board.
- Each processing step should be judged against four constraints together: latency, downlink bandwidth, power and thermal capacity.
- Power is the most underweighted constraint, because onboard compute draws current across the whole orbit, not just during contact windows.
- The split between orbit and ground is fixed in the board specification and can’t be corrected after launch.
Most arguments about edge computing assume a second chance. A gateway in a factory can be swapped. A vehicle can take a new module at the next service interval. Neither assumption survives launch.
The board that goes up is the board that runs the mission. Its power budget was allocated by the spacecraft, its thermal path was designed into the structure, and its interfaces were laid out before any flight software existed. Reconfigurable logic lets you change what a region computes. It gives you no extra bandwidth, current, or thermal headroom to do it with. All three were sized for the plan you had at layout. The onboard and ground split is settled in the specification, and the mission finds out whether it was right.
That is a different problem from the one the literature describes. Academic work on orbital edge computing models scheduling and latency well. Market forecasting sizes the opportunity. Neither tells an engineering team which tasks belong on the spacecraft, and that is the decision in front of them.
Teams that make this call well evaluate each processing step against latency, downlink bandwidth, power, and thermal capacity together, and reach a different answer for different steps in the same pipeline.
The board has to run the tasks the trade assigned it, at the power the spacecraft allocated, through a thermal path the structure can carry, on a device the radiation environment permits, for the mission’s life.
Reconfigurable logic earns its place where the processing has to change after launch and where determinism carries more weight than peak throughput. For a mission-specific pipeline (filtering, compression, classical vision, beamforming), an FPGA holds a timing budget at a power number a GPU-class part will not meet. Large models and general-purpose inference are a separate problem with a separate power profile, and missions are now flying both kinds of hardware.
The physical design is where the trade holds or quietly breaks. Power delivery has to close under worst-case switching, and average draw will not tell you whether it does. Signal integrity has to survive the connector and layer stack at the rates the sensor interface demands. The thermal path has to be simulated against the real duty cycle. Those are separate disciplines and they are validated at the seams between them. A team deep in one and thin in the others finds that out late.
The failure modes are the familiar FPGA ones with the recovery path removed.
Partitioning done early and never revisited puts a task in logic that belonged in software, or in software that belonged in logic, and the interface it implies gets frozen into the board. Simulation skipped in favour of lab work is the expensive one. The lab stops being available at launch, and the bench never reproduced the thermal and radiation environment anyway. Device selection sized for the current requirement leaves no margin for what the operator will ask the payload to do later in a fifteen-year mission.
Each of those is cheap while the design is still a specification. None of them is fixable once the spacecraft is on orbit. That is why the split gets settled as a hardware decision.
The split between orbit and ground is fixed by a board specification, against a power budget, a thermal path and a device list that will not change for the life of the mission. Fidus designs payload compute hardware across FPGA, embedded software, signal and power integrity, and thermal and mechanical work in one team. That combination lets the trade be tested across all four units before anything goes to layout.

Contact Fidus while the split is still a line in a specification.
Onboard payload processing means running data processing on the satellite’s own payload computer before anything is sent to the ground. Typical tasks are filtering, compression, cloud detection and classification.
Sensors now produce more data than downlink windows can carry. Processing in orbit decides what to keep before it uses link capacity. Ground processing only happens after the downlink cost has already been paid.
Two kinds. Tasks whose output has to act before the next ground contact, such as pointing loops or cueing another sensor. And tasks that throw away a large share of data cheaply, such as cloud screening. Tasks that only cut data volume a little rarely justify the permanent power draw.
FPGAs fit mission-specific pipelines like filtering, compression, classical vision and beamforming, where deterministic timing and low power matter most. GPU-class parts suit large models and general-purpose inference, but they draw much more power. Some missions now fly both.
Before PCB layout. Power budget, thermal path and device selection are all fixed at the specification stage and can’t change after launch.
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