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From signal integrity to power consumption, how engineers reduce costly design mistakes before production. The latest advances in combining processors, mixed-signal solutions, and FPGA technology culminate in the sophisticated capabilities of today’s RFSoC (Radio Frequency System On Chip) devices. As the ideal platform for meeting high-performance RF communications needs in a variety of commercial and…
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Presenter: Dr. Syed Bokhari, Fidus Signal Integrity Architect.
High-bandwidth, low-latency solutions come with tradeoffs. To find the right solution for 3D visualization, consider the following requirements:
Today’s analysis and emulation of genetic sequences demands a low-latency, high-bandwidth solution to transfer massive amounts of data between processors.
Creating a differentiated product takes a thoughtful approach to heterogeneous computing.
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What to look for when outsourcing electronic design services.
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Debugging High Speed SERDES issues in Multi-board Interconnect systems.
Our last blog in this series discussed how to deal with component shortages by using replacement parts.
Although component shortages have been common over the last couple years, it has gotten worse with the current supply chain challenges.
With the exponential growth of video streaming, personal gaming, online financial services and IoT edge applications, customers are demanding greater data storage levels and higher delivery speeds.
Trust us to deliver on time. That’s why 95% of our customers come back.
