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Zynq™ UltraScale+™ Resource Tool Kit

Fidus Systems Zynq™ UltraScale+™ Capability Sheet

To deliver a successful Zynq™ UltraScale+™ product, there are 6 fundamentals that must be observed. It’s not stuff like: “use 64-bit DDR4”, “use QSPI boot mode”, “your local Xilinx/Avnet FAE is” or “never spelling it ‘Zinc’”, these are all details that get figured out along the way. Instead, we implore that you focus on the 6 items found in our paper below. They will be the difference between your success or your failure.

MPSoC Capability Sheet

Zynq™ UltraScale+™ Hardware Designer’s Guide

Avoid critical design mistakes! The guide below is an informal read containing secrets and tricks of Zynq™ UltraScale+™ hardware design. For convenience, this document also includes links to the plethora of Xilinx Zynq™ UltraScale+™ documents.

Zynq™ UltraScale+™ Hardware Designer’s Guide

Case Study

Read about a recent Zynq™ UltraScale+™ product completed for Synopsys® in our case study below. This product, called “Mantyss” is based on the largest Zynq™ UltraScale+™ device – the 19EG. The onboard -3 speed grade supports multiple 32 Gbps+ lanes.

The card includes a lot of high-end features: A Linux OS, an FMC+ (VITA 57.4) interface, multiple boot options (e.g. Secure Digital, Dual QSPI, JTAG), Samtec® FireFly copper/optical 16 Gbps/32Gbps interfaces, DDR4, GigE, USB3.0, arm® TRACE Port, etc.

To provide users with complete access to the 19EG, a separate Board Management Controller is leveraged. Believe it or not, this card is 48-layers and 5.5mm thick; quite a feat of design and manufacturing!

Mantyss Case Study

Take advantage of an AMD Premier Partner

As an AMD Alliance Program Premier Partner and HAPS Connect Member, Fidus is uniquely positioned to provide the expertise in product design and support for prototyping that pushes the limits.