Back to top

AMD Xilinx Zynq UltraScale+ Resource Tool Kit

Criteria for designing a successful Zynq UltraScale+project

To deliver a successful AMD Zynq UltraScale+ product, there are 6 fundamentals that must be observed. It’s not about detali like: “use 64-bit DDR4”, “use QSPI boot mode”, “your local Xilinx/Avnet FAE is” or “never spelling it ‘Zinc’”, these are all details that get figured out along the way. Instead, we implore that you focus on the 6 items found in our paper below. They will be the difference between your success or your failure.

A Hardware Designer’s Guide to Building with Zynq UltraScale+

Explore the practical applications and benefits of using the Zynq UltraScale+ Multi-Processor System on Chip technology in Fidus Systems’ comprehensive whitepaper. This guide offers expert insights and detailed advice on selecting, designing, and deploying your next Zynq UltraScale+ based design, providing a deep dive into the most critical design considerations. Reading this document will equip hardware designers and decision-makers with the knowledge to streamline development processes and achieve a faster time-to-market for complex electronic systems.

 

 

 

Case Study

Read about a recent Zynq UltraScale+ product completed for Synopsys® in our case study below. This product, called “Mantyss” is based on the largest Zynq UltraScale+ device – the 19EG. The onboard -3 speed grade supports multiple 32 Gbps+ lanes.

The card includes a lot of high-end features: A Linux OS, an FMC+ (VITA 57.4) interface, multiple boot options (e.g. Secure Digital, Dual QSPI, JTAG), Samtec® FireFly copper/optical 16 Gbps/32Gbps interfaces, DDR4, GigE, USB3.0, arm® TRACE Port, etc.

To provide users with complete access to the 19EG, a separate Board Management Controller is leveraged. Believe it or not, this card is 48-layers and 5.5mm thick; quite a feat of design and manufacturing!

Learn more about Mantyss here: https://fidus.com/mantyss/ 

Fidus & Mantyss Case Study
Download

Leverage our AMD Premier Partnership Status

As North America’s 1st AMD Alliance Premier Partner and HAPS Connect Member, Fidus is uniquely positioned to provide the expertise in product design and support for prototyping that pushes the limits. Our team of engineers and designers are the largest group of AMD-certified professionals in North America outside of AMD itself.