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Build for AMD Xilinx Zynq™ UltraScale+™

Maximize the potential of AMD’s powerful chipset.

2023-AMD-ADP-Partner-of-the-Year-Fidus-Systems

Unlock performance on Versal™ with
AMD’s 2023 ACP Partner of the Year

As the inaugural AMD Premier North American Design Services member, and AMD’s 2023 Adaptive Computing Partner of the Year, we receive exclusive training, certification and early-access to tools, IP, and new silicon. This means you get knowledge and insights at the forefront of AMD’s roadmap, experience with up-to-date tool flows and top preference within the AMD support network to de-risk your projects and enable your team for future success.

Why choose Fidus?

With all skill sets under one roof, we optimize the potential of Zynq UltraScale+ development, with:

  • Expert hardware design (we’ve worked with designs requiring up to 17 sequenced power rails)
  • Signal integrity expertise
  • Strength with Linux OS, including; custom drivers, device trees, Board Support Packages (BSP), and application development
  • Knowledge of small to large FPGA fabrics and transceivers up to 32Gbps+
  • Experience using AMD IP, AMD reference designs and third-party IP

We also own and maintain a fully-stocked laboratory at each design center, so you don’t have to invest in building labs to integrate and debug your designs.

AMD Xilinx Zynq UltraScale+

AMD’s Zynq UltraScale+ is a powerful, highly flexible device that powers sophisticated applications for everything from consumer devices to industrial edge computing. To take advantage of its many features – APUs, RPUs, GPU, MACs, FPGA fabric and more – Fidus engineers are ready to support your team with expert knowledge in hardware, FPGA, software, and thermal design.

Six reasons to choose Fidus

Having completed over 30+ Zynq UltraScale+™ designs in the last couple of years, we’re ideally placed to lower your design risks and accelerate your time to market. With Fidus, you never start from zero on a Zynq UltraScale+ design as our team has essential expertise like schematic blocks, thermal strategies, and code ready to reuse.

Use cases

Heterogeneous computing applications

Learn how Fidus designers help partition and port your designs across the various compute elements to achieve maximum performance.

Edge computing

Learn how Fidus designers help your team with machine learning model architecture and offline model training, including porting, deploying and testing your trained models into FPGA fabric.

End-to-end designs

Learn how Fidus reduced time-to-market for a highly complex Zynq UltraScale+ 19 GB system, including hardware, software and FPGA development, and full bring up, characterization and debug.

Use cases

  • Requirements definition
  • Zynq UltraScale+ device selection
  • Partitioning PS and PL functions
  • Power system budgeting, design, and sequencing
  • BSP and driver design, U-Boot/Linux
  • GStreamer implementations and customization
  • PS implementation and interfacing
  • PS GTR usage and implementation
  • Clocking
  • PL functional block design and PS communication
  • Memory subsystem design and implementation
  • Signal and power integrity
  • High-speed (32Gbps+) PCB layout
  • Thermal assessment and solutions
  • Vivado, PetaLinux
  • Linux, U-Boot
  • DDR4 @ 2400Mbps
  • Boot Options (SecureDigital, QSPI, eMMC, NAND)
  • USB; 2.0 and 3.0 SuperSpeed
  • PCIe; Root and End Point
  • Storage; M.2, NVMe, SATA
  • Video encoding; H.264/H.265, VCU
  • Video Interfaces; HDMI4K, DisplayPort, SDI, MIPI, VPSS

Experience has taught us how to solve problems on any scale

Trust us to deliver on time. That’s why 95% of our customers come back.

Contact us