Webinar – Chip Package – PCB Interconnect Optimization
Presenter: Dr. Syed Bokhari, Fidus Signal Integrity Architect.
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Webinar
Presenter: Dr. Syed Bokhari, Fidus Signal Integrity Architect.
High-bandwidth, low-latency solutions come with tradeoffs. To find the right solution for 3D visualization, consider the following requirements:
Today’s analysis and emulation of genetic sequences demands a low-latency, high-bandwidth solution to transfer massive amounts of data between processors.
Creating a differentiated product takes a thoughtful approach to heterogeneous computing.