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Fidus Solution Portfolio
FPGA code to interface a Mixed Signal Daughter Board to an FPGA Development Platform
DESCRIPTION: We were requested to develop FPGA code to enable a high-performance ADC (analog-to-digital converter) daughterboard to interface to an Altera® Stratix IV® evaluation board. This solution accomplishes two things: It provides our customer with an additional method of evaluating and experimenting with their chipset, and, it provides a piece of IP that their customers can directly incorporate into their end design.
TECHNOLOGIES: Altera® Stratix IV®, SignalTap®, DC1564A, HSMC, FMC, DDR, LVDS
Development and Characterization Platform for a new ASIC enabling the manufacture to prove and demonstrate their new chip
DESCRIPTION: The semiconductor manufacturer asked us to design a board that they could use to both validate functionality as well as characterize operation by placing a thermal hood over their IC. This board allowed our customer to validate I/O operation, internal register operation, and characterize their IC across temperature.
In this type of development, we minimize the support circuitry so that we can minimize project cost, schedule, and risk. This includes utilizing off-the-shelf system on modules (SOMs; in this case a RabbitCore®) in conjunction with simple GUIs, to control the ASIC.
TECHNOLOGIES: Xilinx® FPGA, IC socket, MICTOR, adjustable power supply, RabbitCore®
Emulation Platform for engineers to verify their ASIC code and thus de-risking millions of dollars and months of duration in tape-out
DESCRIPTION: We designed this ASIC emulation board so our customer could validate their RTL prior to committing to ASIC. Built around three Xilinx® Virtex-II PRO® FPGAs (the largest FPGAs in the world at the time), this board met all input/output requirements of the final ASIC, but also included the complexity associated with the multiple high-speed parallel links that allowed the FPGAs to communicate with each other. Note: This could now be done in a single Xilinx® Virtex-7® 2000T.
TECHNOLOGIES: Xilinx® Virtex-II PRO, SDRAM, PCI, PMC, Ethernet, USB, ASIC emulation, JTAG, I2C, SPI, MICTOR
Development Platform for the Xilinx Zynq™ 7035 System-on-a-Chip. Enables engineers with a starting point for their next generation product
DESCRIPTION: A multi-industry design intended to allow customers to evaluate and develop with Xilinx® Zynq™. Relying on our Xilinx Premier member status, we completed this design prior to the general availability of Zynq™, making this one of the first Zynq™ solutions ever created. This early adoption is a hallmark of Fidus’ technology-first attitude, and ensures that we can offer extremely early expertise in the latest pivotal technologies.
TECHNOLOGIES: Xilinx® Zynq™, DDR3 SDRAM, SFP+, LPC FMC, LCD touchscreen, I2C, SPI, JTAG, SERDES, Gigabit Ethernet, USB 2.0, UART, RS232, Pmod, point of use power supplies, power sequencing, power ramp.