PCB Layout

Our seasoned PCB layout designers are some of the best around! You know the kind that uses shortcut keys rather than mouse clicks!

From 2 layer consumer products to 40+ layer multi-gigabit backplanes, you’re in good hands with our IPC recognized layout designers (CID/CID+). Whether your design requires complex technologies such as: blind/buried/micro vias, buried capacitance, precisely controlled impedance, fiber-weave direction control, multi-laminate, or mixed technology stacks – Fidus can do it.  Perhaps you don’t need the latest everything, but cost or other factors are limiting your board construction – we’ll still make that work. Regardless of the design, we always take a practical approach to giving you the best design possible.

Working with our PCB Layout team means not worrying about DFM/DFA rules, high-speed routing, high-current routing, and layer stack-ups.  We’ll take care of it all.  Check out our Capabilities.

  • IPC CID/CID+ accredited designers
  • Signal integrity driven layer stacks and constraint driven placement and routing
  • Experienced with various DFM/DFA/DFT rules
  • High Density Interconnect (HDI): Microvia, blind and buried, via-in-pad, fine-line, buried capacitance
  • High-speed: 12.5Gbps+, wide memory interfaces (DDR3)
  • Impedance and fiber weave direction control
  • Printed antennas and complex wireless routing, including guard trace signal protection
  • Types: Rigid, Flex, Rigid-Flex
  • Materials: FR4, Polyimide, high speed/low loss dielectrics, hybrid constructions (e.g. FR4/Rogers), RoHS
  • Layer counts: 2 to 40+

  • Cadence® Allegro PCB Design XL
  • Cadence OrCAD® Layout
  • Altium PCAD®
  • Altium Protel®
  • Mentor Graphics® PADS®
  • Mentor Graphics® Blaze Route

  • Fidus PCB Layout Capability Sheet Download