Description: This rigid flex design was destined for high-end computer use. There were numerous signal integrity concerns related to a large number of high-speed multi-drop buses and the limited layer stack supported by the flex circuitry; these were all taken care of. There were also major power integrity concerns, as the overall package size and target cost could not support a generic spattering of decade capacitors; the power plane impedance was modeled, and a minimal number of capacitors were selected and precisely placed. In addition, the multi-gigabit interface and power inputs had to be proven to be extremely robust. Then, to top things off, a convection system was unacceptable, so we had to deal with all of the challenges of a fully conduction cooled design.

We proudly say that this product was a huge success for our customer!

Technologies: Undisclosed.

Layers: Undisclosed.

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