Achieving 3D Visualization with Low-Latency, High-Bandwidth Data Acquisition, Transfer, and Storage
High-bandwidth, low-latency solutions come with tradeoffs. To find the right solution for 3D visualization, consider the following requirements:
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As embedded systems and FPGA designs continue to grow in complexity, engineers are constantly seeking ways to maximize the capabilities of the hardware they work with. Understanding the intricacies of AMD Zynq UltraScale+ MPSoC and RFSoC platforms—especially the use of Multiplexed Input/Output (MIO)—is essential for optimizing performance, reducing time-to-market, and ensuring seamless hardware-software integration.
In our latest TechTalk, Implementing and Optimizing MIO on AMD Zynq UltraScale+ MPSoC and RFSoC Platforms, Scott Turnbull, CTO of Fidus Systems, and Jeremy Brooks, Senior Embedded Software Engineer, shared invaluable insights on how to effectively configure and utilize MIO for your projects. With decades of design expertise and over 50 successful Zynq UltraScale+ projects under our belt, Fidus is uniquely positioned to help you tackle the most challenging aspects of embedded system design.
Want the complete technical breakdown? Watch the full webinar here.
MIO, or Multiplexed Input/Output, is a set of configurable pins on Zynq UltraScale+ devices. These pins are dedicated to connecting external peripherals to the Processing System (PS), which houses fixed-function blocks like Ethernet MACs, USB controllers, SPI interfaces, and more.
Unlike the FPGA programmable logic (PL) portion of the chip, MIO is tied to the PS and supports specific hard peripherals. This makes MIO an efficient, power-saving option for interfacing with external hardware while leaving the PL available for high-performance, customizable functions.
Here are the standout features of MIO on Zynq UltraScale+ platforms:
Optimizing MIO configuration is crucial for several reasons:
However, MIO assignments come with limitations—certain peripherals can only map to specific pins. Understanding these constraints and planning accordingly is key to avoiding design bottlenecks. Fidus, an expert in FPGA design, embedded software, and more. delivers precision-driven solutions through their “First-Time-Right” approach, ensuring that designs are optimized from the start.
MIO pins are organized into three banks—each powered by a separate voltage rail (VCC_PS_IO). All pins within a bank must share the same voltage level, making voltage planning a key step in advanced designs.
Advanced Application
Pro Tip: Consider future expandability. Designing with consistent voltage standards across banks simplifies later hardware modifications.
While MIO provides the first line of access to peripherals, advanced systems often combine MIO and Extended MIO (EMIO) to unlock additional connectivity. EMIO enables the use of programmable logic (PL) pins to extend peripheral access when MIO pin counts are exhausted.
Advanced Application
Challenge: Understand the limitations of EMIO, including potential clock synchronization issues when crossing the PS-PL boundary.
For applications requiring high-speed data transfer—such as PCIe, USB 3.0, or DisplayPort—Gigabit Transceivers (GTRs) offer unparalleled performance. However, GTRs have strict lane mapping rules that must align with peripheral requirements.
Advanced Application
Pro Tip: Use Vivado’s signal integrity tools to model GTR performance and verify compliance with high-speed protocol specifications.
The MIO mapping table in AMD’s Technical Reference Manual (TRM) is an essential tool for advanced MIO optimization. This table outlines the specific pin ranges for every PS peripheral and their corresponding MIO assignments.
For instance:
Advanced Application
Pro Tip: When assigning MIO, ensure each pin aligns with its function (e.g., chip select, data, or clock) as outlined in the QSPI controller section of the TRM.
Using AMD’s tools is critical for ensuring your MIO configuration meets design requirements:
Watch the full webinar for an in-depth exploration of these MIO optimization steps, complete with expert insights and practical applications.
Challenge | Description | Solution |
---|---|---|
Peripheral Conflicts | Limited to 78 MIO pins, multiple peripherals may compete for the same resources (e.g., NAND Flash vs. QSPI). | – Use Vivado’s I/O Configuration Tool to identify and resolve conflicts. – Prioritize critical peripherals. |
Voltage Mismatches | Devices with different voltage requirements cannot share the same MIO bank. | – Group peripherals with similar voltage needs into the same bank. – Use external level shifters for mixed-voltage systems. |
Complex High-Speed Configurations | Improper GTR assignments for protocols like PCIe and DisplayPort can lead to performance issues. | – Refer to AMD’s GTR mapping tables for guidance. – Validate configurations using Vitis IDE to ensure proper alignment of clock sources and data lanes. |
The Q&A session of the “Implementing and Optimizing MIO on AMD Zynq UltraScale+ Platforms“ Tech Talk provided actionable advice and real-world insights for engineers:
The MIO subsystem on AMD Zynq UltraScale+ platforms is a powerful enabler for embedded systems, offering a structured yet flexible way to connect peripherals while preserving resources for advanced tasks. By understanding its capabilities and leveraging optimization strategies, engineers can design systems that are not only efficient but also scalable and future-ready.
Whether you are developing IoT gateways, video systems, or edge AI solutions, MIO is a crucial part of the architecture. To learn more about unlocking its full potential, watch our TechTalk and explore the tools and techniques used by industry leaders.
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