Our seasoned PCB layout and IC packaging designers are some of the best around!
From 2 layer consumer products to 40+ layer multi-gigabit backplanes with complex laminates and stack-ups, you’re in good hands with our IPC recognized layout designers (CID/CID+). Whether your design requires complex technologies such as: blind/buried/micro vias, buried capacitance, precisely controlled impedance, fiber-weave direction control, multi-laminate, or mixed technology stacks – Fidus can do it. Perhaps you don’t need the latest everything, but cost or other factors are limiting your board construction – we’ll still make that work. Regardless of the design complexity, we always take a practical approach to providing you with the design that meets your targeted performance and cost.
Working with our PCB Layout team means not having to worry about DFM/DFA rules, high-speed routing, high-current routing, and layer stack-ups. We’ll take care of it all to ensure a high-yield and CM agnostic design. Check out our Capabilities.
In addition to PCB layout, Fidus has IC Packaging design capabilities that are fully complemented by our expert signal integrity team. This means we can design your package and model areas of interest.