Specialists in Electronic Product Development2019-02-11T13:24:37+00:00

welcome to the leading edge of electronic product development

OTTAWA • WATERLOO • SAN JOSE

fidus is a dynamic high-tech
design partner

Fidus specializes in leading-edge electronic product development. Our hardware, software, FPGA and signal integrity teams innovate, design and deliver next-generation products for clients in emerging technology markets. We build long-term relationships by consistently exceeding expectations.

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why choose fidus?

services and products

innovate • design • deliver

Through our expertise, tools and project management, we will provide you with reliable services, delivered on-time and on budget.

ecosystem partners

XILINK - fidus.com
Analog Devices - fidus.com
Communitech - fidus.com
IPC - fidus.com
intoPIX - fidus.com
Northwest Logic - fidus.com
PCI SIG - fidus.com
Synopsys - fidus.com
Tokyo Electron Device - fidus.com

news

  • Fidus Mantyss™-32G™ integrates a Xilinx® Zynq® UltraScale+ with multiple Arm® processors, 32Gbps transceivers, and a collection of other real-world IO peripherals that extend the prototyping interfaces of the Synopsys HAPS Prototyping Solution.

    Ottawa/Waterloo/San Jose – January 23, 2019| Fidus Systems Inc. (Fidus), specializing in customized electronic designs, today announced the Fidus Mantyss-32G - a daughter board for the Synopsys HAPS prototyping solution based on the Xilinx ZU19EG MPSoC. This versatile product extends the Synopsys HAPS prototyping solution with Arm processors and 32Gbps high speed transceivers to further accelerate prototyping of the latest generation of ASICs.

    Highlights

    The Fidus Mantyss-32G

    • integrates a quad-core Arm Cortex®-A53-based sub-system into the Synopsys HAPS prototyping environment
    • provides HAPS access to numerous high-speed links at rates up to 32Gbps
    • connects directly to the Synopsys HAPS system with interoperability verified by Synopsys
    • offers convenience and flexibility with the support of common interfaces and debugging ports
    • accelerates bring up with available example designs

    The Fidus Mantyss-32G is a six HT3 connector daughter board purposefully designed to extend the capabilities of the Synopsys HAPS prototyping solution. Mantyss-32G is architected using the highest speed grade Xilinx Zynq UltraScale+ ZU19EG MPSoC, featuring a quad-core Arm processor sub-system, twenty-four 16Gbps links and sixteen 32Gbps links. In addition to connecting directly to the HAPS systems, the Mantyss-32G boasts additional features, including DDR4, GigE, FMC+, an SD expansion port, a configurable clocking subsystem, and other PS and PL interfaces.

    “A high value addition to the Synopsys HAPS prototyping ecosystem, the Mantyss-32G extends the capabilities of the HAPS prototyping solution by providing a direct connection to the Arm processors and 32Gbps transceivers in the ZU19EG” said Patrick Gurtler, Director of Research and Development at Fidus Systems. “Further expansion through the FMC+ or SD card and numerous I/O interfaces makes the Mantyss-32G an exceptionally versatile solution to quickly expand the HAPS interfaces.”

    Through the Synopsys HAPS Connect Program, Fidus and Synopsys worked collaboratively, ensuring that the Fidus Mantyss-32G integrated seamlessly into the Synopsys HAPS prototyping solution. “The HAPS Connect program played an important role in the development of Mantyss-32G. Facilitated by the program, we co-developed the features and verified the integration and operation of Mantyss-32G” added Gurtler.

    "We expand the value of our market-leading HAPS prototyping solution through collaborations with Synopsys HAPS Connect Program hardware partners like Fidus Systems to deliver innovative solutions that extend the real-world system validation interfaces," said Neil Songcuan, sr. product marketing manager at Synopsys. "The Mantyss-32G daughter board enables software developers and system validation engineers to increase their productivity and accelerate time-to-market in this critically fast-paced market.”

    Fidus Mantyss-32G boards will be available in April 2019 and are supported with technical documentation/FAQs and example designs. To purchase, or request a quote, visit www.fidus.com/Products/Mantyss

    fidus partners

    Editorial Contact: Patrick Gurtler, Director of Research and Development, Fidus Systems Office: 1 613.595.0507 x 366 | pat.gurtler@fidus.com

fidus delivers versatile, high performance daughter board for Synopsys® HAPS® prototyping solution

January 22nd, 2019|

Fidus Mantyss™-32G™ integrates a Xilinx® Zynq® UltraScale+™ with multiple Arm® processors, 32Gbps transceivers, and a collection of other real-world IO peripherals that extend the prototyping [...]

  • Based on quality, relevance, impact, and originality, Syed’s paper "On the Minimization of PCB Differential Pair Skew or Its Effect" has been chosen as a finalist for a DesignCon 2019 Best Paper Award. Congratulations!

     

    Syed Bokhari of Fidus is set to speak at DesignCon 2019 at the Santa Clara Convention Center on January 30, 2019.

    Description: This paper presents two new methods for dealing with skew. Fiber-weave effect is minimized using a non-uniform differential pair. It consists of a hybrid combination of edge-coupled and broadside-coupled differential geometries. Traces are routed as "complementary twisted pairs". Skew results in fading at a precise frequency and its multiples. It is discovered that the effect of skew can be reduced by using multiple strongly coupled elements. An exact analytical solution is derived for the differential insertion loss of a link comprising two tightly coupled sections. Numerical results are validated using 3D EM field solvers.

    Takeaway: Why is differential pair skew so important? Because it causes fading! One can either "cure" the disease, or its symptoms. The disease is predominantly caused by a non-uniformity in the substrate material. Here we show that it, or, its symptoms can be cured by using non-uniform transmission lines.

    The three-day conference will consist of more than 100 technical sessions spanning 15 tracks. More information about this event is available here.

    Syed Bokhari Technical Manager of SI and EMC Fidus Systems Inc.

Syed Bokhari of Fidus to Speak at DesignCon

January 11th, 2019|

Based on quality, relevance, impact, and originality, Syed’s paper "On the Minimization of PCB Differential Pair Skew or Its Effect" has been chosen as a [...]

Meet the Fidus team at XDF!

September 19th, 2018|

Meet the Fidus team at XDF! October 1-2  l  Fairmont - 170 South Market Street, San Jose CA  |  xilinx.com Fidus will be exhibiting at the [...]

Meet the Fidus team at IBC!

September 6th, 2018|

Meet the Fidus team at IBC! September 14-18, RAI Amsterdam | Ontario Pavilion | Stand 2.A41 | show.ibc.org Fidus will be exhibiting at IBC 2018 [...]