Fidus attended DesignCon


The DesignCon Technical Conference Program consists of 14 tracks covering all aspects of electronic design, from chips through boards and systems.

Through more than 100 technical paper sessions, panels and tutorials, conference attendees gather the latest theories, methodologies, applications and advanced design tools related to signal integrity, power integrity, jitter, crosstalk, test and measurement, parallel and memory interface design, ICs, semiconductor components and more.

DesignCon 2016 will be host to three insightful, informative and inspirational keynotes from industry luminaries.

Selected through a rigorous review process conducted by the Technical Program Committee, DesignCon speakers constitute an elite group of practicing engineers, offering leading-edge case studies, technology innovations, practical techniques, design tips and application overviews.


By |2019-01-18T13:52:32+00:00January 21st, 2016|News, Archive|0 Comments