A multi-industry design intended to allow customers to evaluate and develop with Xilinx® Zynq®. Relying on our Xilinx Premier member status, we completed this design prior to the general availability of Zynq, making this one of the first Zynq solutions ever created. This early adoption is a hallmark of Fidus’ technology-first attitude, and ensures that we can offer extremely early expertise in the latest pivotal technologies.

Technologies: Xilinx® Zynq®, DDR3 SDRAM, SFP+, LPC FMC, LCD touchscreen, I2C, SPI, JTAG, SERDES, Gigabit Ethernet, USB 2.0, UART, RS232, Pmod, point of use power supplies, power sequencing, power ramp.

Layers: 14

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