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MACOM, Xilinx, Fidus Systems and Inrevium Develop 12G-SDI FPGA Mezzanine Card

Xilinx’s FMC platform utilizes MACOM’s 12G-SDI Chipset to enable 4K60p video on a single channel, quadrupling video throughput and processing

SOURCE MACOM

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Lowell, MA, September 9, 2014 – M/A-COM Technology Solutions Inc. (MACOM), a leading supplier of semiconductor solutions for broadcast video infrastructure, announced today that Inrevium’s Xilinx-targeted FPGA Mezzanine Card (FMC) utilizes MACOM’s 12G-SDI Chipset to enable 4K60p video. Based on a collaboration with Fidus Systems and Inrevium, the solution supports the proposed 12G-SDI standard and quadruples the video throughput and processing that can be achieved on a single card.“12G-SDI is the next node on the evolution of the SDI standard. By entering into collaboration, Xilinx can now offer customers the ability to process 4K60p images with a single link connection, dramatically increasing the amount of video processing that can be achieved on a single card,” said Gary Shah, VP of Marketing, High Performance Analog, MACOM. “We are excited to deliver solutions that enable the broadcast industry to migrate to higher resolutions.”

“Our customers are developing 4K60p systems using Xilinx All Programmable FPGA and SoC devices. MACOM’s 12G-SDI components along with the Fidus/Inrevium 12G-SDI FMC provide a development platform that enables customers to process their video content through a single link,” said Aaron Behman, Segment Lead for the Broadcast Business at Xilinx.

MACOM’s family of 12G-SDI products are currently shipping in volume. These MACOM products, as well as the new 12G-SDI FMC card will be shown at IBC 2014 in booth 8.C01 (Hall 8) of the RAI convention center in Amsterdam.

For more information about IBC 2014, please visit www.ibc.org.

ABOUT MACOM:
M/A-COM Technology Solutions Holdings, Inc. (www.macom.com) is a leading supplier of high performance analog RF, microwave, and millimeter wave products that enable next-generation Internet and modern battlefield applications. Recognized for its broad catalog portfolio of technologies and products, MACOM serves diverse markets, including high speed optical, satellite, radar, wired & wireless networks, CATV, automotive, industrial, medical, and mobile devices. A pillar of the semiconductor industry, we thrive on more than 60 years of solving our customers’ most complex problems, serving as a true partner for applications ranging from RF to Light.

Headquartered in Lowell, Massachusetts, M/A-COM Tech is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. M/A-COM Tech has design centers and sales offices throughout North America, Europe, Asia and Australia.

MACOM, M/A-COM, M/A-COM Technology Solutions, M/A-COM Tech, Partners in RF & Microwave, The First Name in Microwave and related logos are trademarks of MACOM. All other trademarks are the property of their respective owners.

For more information about MACOM, please visit www.macom.com follow @MACOMtweets on Twitter; join MACOM on LinkedIn, or visit the MACOM YouTube Channel.

ABOUT XILINX:
Xilinx is the world’s leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.

ABOUT FIDUS SYSTEMS:
Fidus Systems provides Electronic Product Development and Consulting Services across a wide range of industries. Focusing on high-speed, high complexity designs, Fidus enables your success with four design centers and flexible business models. Fidus delivers excellence in Hardware, FPGA, Signal Integrity, Embedded Software, RF, PCB Layout, and Mechanical design. Fidus is proud to be the inaugural Xilinx Alliance Program Premier Design Services Member in North America. Visit fidus.com.

ABOUT INREVIUM:
Inrevium offers FPGA platform solutions, market specific IP, technical support, and design services to customers worldwide. inrevium is a Xilinx Alliance Program Premier Design Services Member and delivers the highest level of market and domain-specific expertise and pre-qualified solutions through Xilinx All Programmable platforms. The Design and Development Center uses its wealth of customer project experience and the latest equipment to provide specialized customer design services. The Development Center also creates market-specific multi-million gate LSI devices, FPGA evaluation boards, FMC option cards, ASIC prototyping boards, drivers, firmware, and IP to support a wide range of applications. For more information, please visit solutions.inrevium.com.

DISCLAIMER FOR NEW PRODUCTS:
Any express or implied statements in MACOM product announcements are not meant as warranties or warrantable specifications of any kind. The only warranty MACOM may offer with respect to any product sale is one contained in a written purchase agreement between MACOM and the purchaser concerning such sale and signed by a duly authorized MACOM employee, or, to the extent MACOM’s purchase order acknowledgment so indicates, the limited warranty contained in MACOM’s standard Terms and Conditions for Quotation or Sale, a copy of which may be found at: www.macom.com/support.

FOR SALES INFORMATION, PLEASE CONTACT:
North Americas — Phone: 800.366.2266
Europe — Phone: +353.21.244.6400
India — Phone: +91.80.43537383
China – Phone: +86.21.2407.1588

MEDIA CONTACTS:
Husrav Billimoria
M/A-COM Technology Solutions Inc.
978-656-2896
Husrav.Billimoria@macom.com

Colin Boroski
Rainier Communications
508-475-0025 x142
cboroski@rainierco.com

Gerlinde Knoepfle
embedded PR
+49 (0)89 64913634-12
gk@embedded-pr.de

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July 30, 2014 – IEEE Distinguished Lecturer Presentation hosted jointly by the IEEE Ottawa EMC Chapter, and the IEEE Ottawa MTT/AP Chapter

2014.07.22 IEEE Presentation Yihongss_smWednesday July 30, 2014
6:00 PM to 8:00 PM
Fidus Systems Inc.,35 Fitzgerald Road, Suite 400
Ottawa, ON,K2H 1E6

Speaker: Dr. Yihong Qi, Chief Scientist, General Test Systems Inc.
Topic: Over The Air Test for Wireless Systems
Organizer: Dr. Syed Bokhari, Chairman, IEEE Ottawa EMC chapter

Embedded Vision Summit West 2014 Achieves Record Attendance

Embedded Vision Alliance announces plans for 2015 Summit

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WALNUT CREEK, Calif., June 25, 2014
SOURCE Embedded Vision AllianceThe Embedded Vision Alliance (www.Embedded-Vision.com) today announced that nearly 500 product creators attended the recent Embedded Vision Summit West to learn about the latest in computer vision technology from leading technologists. Members of the Embedded Vision Alliance were thrilled at the record attendance and at the keen interest in their technology from attendees.

The Embedded Vision Summit West 2015 was held on May 29 at the Santa Clara Convention Center. Like previous Embedded Vision Summits, it was organized by the Embedded Vision Alliance to give engineers the practical information they need to design systems and applications that have the ability to see and understand. Chris Rowen, Fellow at Cadence Design Systems, an Embedded Vision Alliance Member company, observed, “Vision intelligence is becoming one of the primary interfaces for so many products—for the cloud, Internet of Things, and next-generation consumer products and mobile devices. The Summit is a wonderful convergence of so many different ideas, companies and trends. Not only is it a great place to catch up with what’s going on in computer vision, it’s become the place where people from other areas come to explore one of the grand challenges in semiconductors, system software, and design methodology.”

Attendees were impressed at the opportunities the Summit provided. Richard Neumann, founder of startup 2r1y, said, “We’ve made some amazing contacts here and I now see great opportunities for our company that I didn’t think existed when I got here this morning.”

Simon Morris, CEO of Alliance member CogniVue Corporation was unequivocal in his company’s support for the event, saying, “The Summit is one of the best places we can go to network with future customers and partners. In fact, half of the partners we have, we met at an Embedded Vision Summit. It’s really valuable as a focused event where we gain both partners and customers.”
The Alliance has also announced that the next Embedded Vision Summit will be held on April 30, 2015, at the Santa Clara Convention Center. Planning is under way for an expanded conference program, with business, introductory technical, and advanced technical tracks. The 2015 Summit will also include a bigger Technology Showcase, with demos of computer vision technology by industry innovators, as well as exciting keynote presentations by leading technologists.

The Embedded Vision Summit is organized by the Embedded Vision Alliance, an industry partnership that brings together providers of the technology used to create practical applications of computer vision. Founded in May 2011, the Alliance currently has 37 Member companies worldwide. Membership is open to any company that supplies hardware, software, or design services for computer vision systems and applications. To join the Alliance or participate in the 2015 Summit, contact the Alliance at membership@embedded-vision.com.

Media Contact:
Brian Dipert
dipert@Embedded-Vision.com
+1 (530) 414-6908

Business Contact:
Jeremy Giddings
giddings@Embedded-Vision.com
+1 (925) 954-1411

51st DAC “Take A Shot” contest results are in! 2014

EELive! Take A Shot

Fidus Systems hosted our famous “Take A Shot” contest at the 51st DAC Show in San Francisco from June 2-4, 2014.
Over 200 people took a shot

Challenge: How many 0805 resistors are in our 2 ounce shot glass?
Answer: 23, 547 resistors
Closest Guess: 24, 000
Runner Up: 23, 000

Well done folks!!
A big thank you to everyone who participated in our contest!

Day 1 at the 51st DAC show in San Francisco! 2014

Fidus trio.1

Today Fidus Systems Inc. and inrevium AMERICA proudly displayed our Xilinx based demos at the 51st DAC Show in San Francisco.
We’ll be in town Mon June 2nd- Wed June 4th; we’re presenting live demos and sharing our secrets about our exceptional design services.
Drop by booth 606 to visit with our team, learn about our in-house capabilities and design services, and to try our “Take A Shot” Contest!

We’re pleased to say that day 1 of DAC 2014 was a big success!

Design Automation Conference

DAC

Conf.. June 1-5, 2014
Expo. June 2-4, 2014
San Francisco’s downtown district, The Moscone Center
800 Howard St. San Francisco, CA 94103

Swing by our Fidus Booth #606 to learn how Fidus can get your product to market faster.
*DAC is the premier conference devoted to the design and automation of electronic systems (EDA), embedded systems and software (ESS), and intellectual property (IP).

For more information:
https://dac.com

What’s the dirt?

Mud Hero 2014 - After

Fidus Mud Heroes 2014

Fidus has 8 Guiding Principles; one of which is “Fit and Healthy”. In an effort to stay on par with our principles, 11 Fidus personnel made up our team for the 2014 Ottawa-Mud Hero obstacle course. On May 31st, 2014 our team got down and dirty when we ran a 6km race through a muddy forest complete with water passages and 20+ obstacles.

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The anticipation built up as our team members lined the start line ready for action… the DJ counted down our wave of 150 people; then bam – we were off! We climbed walls, treaded through swamp water, trudged through mud pits, slid down fire poles and slides into marshy water, and wiggled through tunnels… needless to say, we experienced it all and we had a blast!! Every team member completed the race with a smile on our face. We are very proud to have completed the course with our friends/colleagues by our side cheering us on and helping us to overcome the challenging obstacles. GO TEAM!Fidus has a great team; the Mud Hero obstacle course proved that as a team we are unstoppable.

*Note: Mud Hero raised $102,634 for the Ottawa Regional Cancer Foundation
*Note: We spent the next 3 days in the shower, and we’re still finding sand in places it doesn’t belong!

Fidus Provides Embedded Vision Solutions

Fidus Systems is a proud member of the Embedded Vision Alliance!

What does this mean?
It means that with the support of the EVA we’re designing systems that see and understand—pretty neat eh? Watch the VIDEO below to learn about Fidus’ newest products and the latest technologies.May 2014 Fidus was part of the Embedded Vision Summit Product Demonstrations of FPGA Acceleration and Video Processing.  Watch video below to learn more about our Xilinx Zynq Processor, Video Processing on Virtex 7 and our first ever FMC by Fidus–an 8 channel analog to digital converter card.

The 2014 Embedded Vision Alliance Summit (West)

EVSummit_West2014e

Learn to Design
“Machines That See”!

May 29, 2014
Santa Clara Convention Ctr
5001 Great America Parkway
Santa Clara, CA 95054

*held in conjunction with the Augmented World Expo
For more information:

http://www.embedded-vision.com/summit/may2014/overview